产品制造商
提交询价BOM 工具

K4B8G0446D-MYH90

Samsung Semiconductor, Inc.

Samsung Semiconductor, Inc. K4B8G0446D-MYH90
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.36
  • SB Code
    8542.32.00.23
  • Width
    7.5 mm
  • Length
    11 mm
  • Technology
    CMOS
  • Access Mode
    MULTI BANK PAGE BURST
  • JESD-30 Code
    R-PBGA-B78
  • Memory Width
    4
  • Organization
    2GX4
  • Package Code
    TFBGA
  • Self Refresh
    YES
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY, THIN PROFILE, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Memory Density
    8589934592 bit
  • Memory IC Type
    DDR3L DRAM
  • Operating Mode
    SYNCHRONOUS
  • Terminal Pitch
    0.8 mm
  • Number of Ports
    1
  • Number of Words
    2147483648 words
  • Seated Height-Max
    1.2 mm
  • Temperature Grade
    OTHER
  • Terminal Position
    BOTTOM
  • Additional Feature
    AUTO/SELF REFRESH
  • Number of Functions
    1
  • Number of Terminals
    78
  • Number of Words Code
    2G
  • Package Body Material
    PLASTIC/EPOXY
  • Operating Temperature-Max
    85 Cel
  • Operating Temperature-Min
    0 Cel
  • Supply Voltage-Max (Vsup)
    1.45 V
  • Supply Voltage-Min (Vsup)
    1.283 V
  • Supply Voltage-Nom (Vsup)
    1.35 V

K4B8G0446D-MYH90有0家供应商货源可供购买或竞价

提交询价

您的询价单将直接发送给我们的销售专家: Pari

提交询价
K4B8G0446D-MYH90
提交询价
K4B8G0446D-MYH90