Samsung Semiconductor, Inc. K4B2G0846E-MCF70 | 搜芯易Sourcengine

Samsung Semiconductor, Inc. K4B2G0846E-MCF70

生命周期状态
Active-Unconfirmed
RoHS
符合RoHS标准
REACH
REACH compliant
说明
DDR3 DRAM, 256MX8, 0.4ns, CMOS, PBGA78
类别
Semiconductors Memory ICs DRAMs DDR3 DRAM

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8542.32.00.36
SB Code
8542.32.00.23

I/O Type
COMMON
Technology
CMOS
JESD-30 Code
R-PBGA-B78
Memory Width
8
Organization
256MX8
Package Code
FBGA
Package Shape
RECTANGULAR
Package Style
GRID ARRAY, FINE PITCH Meter
Surface Mount
YES
Terminal Form
BALL
Memory Density
2147483648 bit
Memory IC Type
DDR3 DRAM
Refresh Cycles
8192
Terminal Pitch
0.8 mm
Access Time-Max
0.4 ns
Number of Words
268435456 words
Temperature Grade
OTHER
Terminal Position
BOTTOM
Supply Current-Max
200 mA
Number of Terminals
78
Standby Current-Max
0.02 Amp
Number of Words Code
256M
Qualification Status
Not Qualified
Package Body Material
PLASTIC/EPOXY
Output Characteristics
3-STATE
Package Equivalence Code
BGA78,9X13,32
Operating Temperature-Max
85 Cel
Operating Temperature-Min
0 Cel
Supply Voltage-Nom (Vsup)
1.5 V
Clock Frequency-Max (fCLK)
400 MHz