SAMSUNG ELECTRO-MECHANICS K3UH6H60BM-AGCL0 | 搜芯易Sourcengine

SAMSUNG ELECTRO-MECHANICS K3UH6H60BM-AGCL0

生命周期状态
Active
说明
LPDDR4X DRAM, 768MX64, CMOS, PBGA556
类别
Semiconductors Memory ICs DRAMs LPDDR4X DRAM

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8542.32.00.36
SB Code
8542.32.00.23

Technology
CMOS
JESD-30 Code
R-PBGA-B556
Memory Width
64
Package Code
BGA
Package Shape
RECTANGULAR
Package Style
GRID ARRAY Meter
Surface Mount
YES
Terminal Form
BALL
Memory IC Type
LPDDR4X DRAM
Operating Mode
ASYNCHRONOUS
Number of Ports
1
Terminal Position
BOTTOM
Memory Organization
768MX64
Number of Functions
1
Number of Terminals
556
Number of Words Code
768M
Memory Density (bits)
51539607552
Package Body Material
PLASTIC/EPOXY
Supply Voltage-Nom (V)
1.8
Number of Words (words)
805306368
Operating Temperature-Max (Cel)
85
Operating Temperature-Min (Cel)
-25