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K3P7V1000B-FC100

Samsung Semiconductor, Inc.

Samsung Semiconductor, Inc. K3P7V1000B-FC100
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.71
  • SB Code
    8542.32.00.70
  • Width
    9 mm
  • Length
    9 mm
  • Technology
    CMOS
  • JESD-30 Code
    S-PBGA-B48
  • Memory Width
    16
  • Organization
    4MX16
  • Package Code
    TFBGA
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY, THIN PROFILE, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Memory Density
    67108864 bit
  • Memory IC Type
    MASK ROM
  • Operating Mode
    ASYNCHRONOUS
  • Terminal Pitch
    0.75 mm
  • Access Time-Max
    100 ns
  • Number of Words
    4194304 words
  • Parallel/Serial
    PARALLEL
  • Seated Height-Max
    1.2 mm
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    BOTTOM
  • Number of Functions
    1
  • Number of Terminals
    48
  • Number of Words Code
    4M
  • Qualification Status
    Not Qualified
  • Package Body Material
    PLASTIC/EPOXY
  • Alternate Memory Width
    8
  • Operating Temperature-Max
    70 Cel
  • Operating Temperature-Min
    0 Cel
  • Supply Voltage-Max (Vsup)
    3.6 V
  • Supply Voltage-Min (Vsup)
    3 V
  • Supply Voltage-Nom (Vsup)
    3.3 V
  • Peak Reflow Temperature (Cel)
    240
  • Time@Peak Reflow Temperature-Max (s)
    30

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