Winbond Electronics Corporation ISD4003-06MZI
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.39.00.00
  • Technology
    CMOS
  • Width (mm)
    4.7
  • Application
    HAND-HELD DEVICES
  • Length (mm)
    7.45
  • JESD-30 Code
    R-PBGA-B19
  • Package Code
    VFBGA
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY, VERY THIN PROFILE, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • J-STD-609 Code
    e0
  • Terminal Finish
    TIN LEAD
  • Consumer IC Type
    SPEECH SYNTHESIZER WITH RCDG
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    BOTTOM
  • Number of Functions
    1
  • Number of Terminals
    19
  • Terminal Pitch (mm)
    0.75
  • Reading Time-Max (s)
    360
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    0.85
  • Supply Voltage-Max (V)
    3.3
  • Supply Voltage-Min (V)
    2.7
  • Supply Current-Max (mA)
    40
  • Package Equivalence Code
    BGA19,4X5,30
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40

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