产品制造商
提交询价BOM 工具

IS61QDPB44M18A-550B4LI

Integrated Silicon Solution Inc.

Integrated Silicon Solution Inc. IS61QDPB44M18A-550B4LI
  • ECCN
    3A991.b.2.a
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.41
  • SB Code
    8542.32.00.40
  • I/O Type
    SEPARATE
  • Technology
    CMOS
  • Width (mm)
    13
  • Length (mm)
    15
  • JESD-30 Code
    R-PBGA-B165
  • Memory Width
    18
  • Package Code
    LBGA
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY, LOW PROFILE Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Memory IC Type
    QDR SRAM
  • Operating Mode
    SYNCHRONOUS
  • Parallel/Serial
    PARALLEL
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    BOTTOM
  • Additional Feature
    PIPELINED ARCHITECTURE
  • Memory Organization
    4MX18
  • Number of Functions
    1
  • Number of Terminals
    165
  • Terminal Pitch (mm)
    1
  • Access Time-Max (ns)
    0.45
  • Number of Words Code
    4M
  • Memory Density (bits)
    75497472
  • Package Body Material
    PLASTIC/EPOXY
  • Output Characteristics
    3-STATE
  • Seated Height-Max (mm)
    1.4
  • Supply Voltage-Max (V)
    1.89
  • Supply Voltage-Min (V)
    1.71
  • Supply Voltage-Nom (V)
    1.8
  • Number of Words (words)
    4194304
  • Standby Current-Max (A)
    0.38
  • Standby Voltage-Min (V)
    1.71
  • Supply Current-Max (mA)
    1250
  • Package Equivalence Code
    BGA165,11X15,40
  • Clock Frequency-Max (MHz)
    550
  • Peak Reflow Temperature (Cel)
    260
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40

IS61QDPB44M18A-550B4LI有0家供应商货源可供购买或竞价

提交询价

您的询价单将直接发送给我们的销售专家: Pari

提交询价
IS61QDPB44M18A-550B4LI
提交询价
IS61QDPB44M18A-550B4LI