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IDTI9RC64T574-333DZ

Integrated Device Technology, Inc.

Integrated Device Technology, Inc. IDTI9RC64T574-333DZ
  • ECCN
    3A991.a.2
  • ECCN Governance
    EAR
  • HTS Code
    8542.31.00.30
  • SB Code
    8542.31.00.30
  • Format
    FLOATING POINT
  • Bit Size
    64
  • Technology
    CMOS
  • Width (mm)
    27.69
  • Length (mm)
    27.69
  • Speed (MHz)
    333
  • JESD-30 Code
    S-PQFP-G128
  • Package Code
    QFP
  • Boundary Scan
    YES
  • Package Shape
    SQUARE
  • Package Style
    FLATPACK Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • J-STD-609 Code
    e0
  • Low Power Mode
    NO
  • Terminal Finish
    TIN LEAD
  • Integrated Cache
    YES
  • Address Bus Width
    32
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    OTHER
  • Terminal Position
    QUAD
  • Number of Terminals
    128
  • Terminal Pitch (mm)
    0.8
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    3.86
  • Supply Voltage-Max (V)
    2.625
  • Supply Voltage-Min (V)
    2.375
  • Supply Voltage-Nom (V)
    2.5
  • External Data Bus Width
    32
  • Clock Frequency-Max (MHz)
    125
  • uPs/uCs/Peripheral ICs Type
    MICROPROCESSOR, RISC
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    0

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