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IDT79RC32T355-133DPI

Integrated Device Technology, Inc.

Integrated Device Technology, Inc. IDT79RC32T355-133DPI
  • ECCN
    3A991.a.2
  • ECCN Governance
    EAR
  • HTS Code
    8542.31.00.25
  • SB Code
    8542.31.00.25
  • Bit Size
    32
  • Technology
    CMOS
  • Width (mm)
    28
  • Length (mm)
    28
  • Speed (MHz)
    67
  • ADC Channels
    NO
  • DAC Channels
    NO
  • DMA Channels
    YES
  • JESD-30 Code
    S-PQFP-G208
  • PWM Channels
    NO
  • Package Code
    FQFP
  • Package Shape
    SQUARE
  • Package Style
    FLATPACK, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • J-STD-609 Code
    e0
  • Terminal Finish
    TIN LEAD
  • Address Bus Width
    26
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    QUAD
  • Number of I/O Lines
    36
  • Number of Terminals
    208
  • Terminal Pitch (mm)
    0.5
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    4.1
  • Supply Voltage-Max (V)
    2.625
  • Supply Voltage-Min (V)
    2.375
  • Supply Voltage-Nom (V)
    2.5
  • External Data Bus Width
    32
  • Package Equivalence Code
    QFP208,1.2SQ,20
  • Clock Frequency-Max (MHz)
    67
  • Moisture Sensitivity Level
    3
  • uPs/uCs/Peripheral ICs Type
    MICROCONTROLLER, RISC
  • Peak Reflow Temperature (Cel)
    225
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40
  • Time@Peak Reflow Temperature-Max (s)
    30

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