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IDT74ALVCH162345PA

Integrated Device Technology, Inc.

Integrated Device Technology, Inc. IDT74ALVCH162345PA
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.39.00.00
  • Technology
    CMOS
  • JESD-30 Code
    R-PDSO-G56
  • Package Code
    TSSOP
  • Logic IC Type
    LOGIC CIRCUIT
  • Package Shape
    RECTANGULAR
  • Package Style
    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • J-STD-609 Code
    e0
  • Terminal Finish
    TIN LEAD
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    DUAL
  • Number of Terminals
    56
  • Terminal Pitch (mm)
    0.5
  • Package Body Material
    PLASTIC/EPOXY
  • Supply Voltage-Nom (V)
    3.3
  • Package Equivalence Code
    TSSOP56,.3,20
  • Moisture Sensitivity Level
    1
  • Peak Reflow Temperature (Cel)
    240
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40
  • Time@Peak Reflow Temperature-Max (s)
    20

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IDT74ALVCH162345PA