Integrated Device Technology, Inc. IDT72V845L15PFI9
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.71
  • SB Code
    8542.32.00.70
  • Technology
    CMOS
  • Width (mm)
    14
  • Length (mm)
    20
  • JESD-30 Code
    R-PQFP-G128
  • Memory Width
    18
  • Package Code
    LFQFP
  • Output Enable
    YES
  • Package Shape
    RECTANGULAR
  • Package Style
    FLATPACK, LOW PROFILE, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • J-STD-609 Code
    e0
  • Memory IC Type
    BI-DIRECTIONAL FIFO
  • Operating Mode
    SYNCHRONOUS
  • Cycle Time (ns)
    15
  • Parallel/Serial
    PARALLEL
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    QUAD
  • Memory Organization
    4KX18
  • Number of Functions
    1
  • Number of Terminals
    128
  • Terminal Pitch (mm)
    0.5
  • Access Time-Max (ns)
    10
  • Number of Words Code
    4K
  • Memory Density (bits)
    73728
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    1.6
  • Supply Voltage-Max (V)
    3.6
  • Supply Voltage-Min (V)
    3
  • Supply Voltage-Nom (V)
    3.3
  • Number of Words (words)
    4096
  • Supply Current-Max (mA)
    400
  • Moisture Sensitivity Level
    3
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40
  • Time@Peak Reflow Temperature-Max (s)
    NOT SPECIFIED

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