Integrated Device Technology, Inc. IDT72V3632L10PQF
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.71
  • SB Code
    8542.32.00.70
  • Technology
    CMOS
  • Width (mm)
    24.13
  • Length (mm)
    24.13
  • JESD-30 Code
    S-PQFP-G132
  • Memory Width
    36
  • Package Code
    BQFP
  • Output Enable
    YES
  • Package Shape
    SQUARE
  • Package Style
    FLATPACK, BUMPER Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • J-STD-609 Code
    e0
  • Memory IC Type
    BI-DIRECTIONAL FIFO
  • Operating Mode
    SYNCHRONOUS
  • Cycle Time (ns)
    10
  • Parallel/Serial
    PARALLEL
  • Terminal Finish
    TIN LEAD
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    QUAD
  • Additional Feature
    MAIL BOX BYPASS REGISTER
  • Memory Organization
    512X36
  • Number of Functions
    1
  • Number of Terminals
    132
  • Terminal Pitch (mm)
    0.635
  • Access Time-Max (ns)
    6.5
  • Number of Words Code
    512
  • Memory Density (bits)
    18432
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    4.57
  • Supply Voltage-Max (V)
    3.45
  • Supply Voltage-Min (V)
    3.15
  • Supply Voltage-Nom (V)
    3.3
  • Number of Words (words)
    512
  • Standby Current-Max (A)
    0.001
  • Supply Current-Max (mA)
    400
  • Package Equivalence Code
    SPQFP132,1.1SQ
  • Clock Frequency-Max (MHz)
    100
  • Moisture Sensitivity Level
    3
  • Peak Reflow Temperature (Cel)
    225
  • Operating Temperature-Max (Cel)
    70
  • Operating Temperature-Min (Cel)
    0
  • Time@Peak Reflow Temperature-Max (s)
    30

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