Integrated Device Technology, Inc. IDT72T6480L10BBI | 搜芯易Sourcengine

Integrated Device Technology, Inc. IDT72T6480L10BBI

生命周期状态
Discontinued
说明
Microprocessor Circuit, CMOS, PBGA324
类别
Semiconductors UPs/uCs/Peripheral ICs Other uPs/uCs/Peripheral ICs MICROPROCESSOR CIRCUIT

HTS Code
8542.31.00.30
SB Code
8542.31.00.30

Technology
CMOS
Width (mm)
19
Length (mm)
19
JESD-30 Code
S-PBGA-B324
Package Code
BGA
Package Shape
SQUARE
Package Style
GRID ARRAY Meter
Surface Mount
YES
Terminal Form
BALL
J-STD-609 Code
e0
Terminal Finish
Tin/Lead (Sn63Pb37)
DLA Qualification
Not Qualified
Temperature Grade
INDUSTRIAL
Terminal Position
BOTTOM
Number of Terminals
324
Terminal Pitch (mm)
1
Package Body Material
PLASTIC/EPOXY
Seated Height-Max (mm)
1.72
Supply Voltage-Max (V)
2.625
Supply Voltage-Min (V)
2.375
Supply Voltage-Nom (V)
2.5
Supply Current-Max (mA)
650
Package Equivalence Code
BGA324,18X18,40
Moisture Sensitivity Level
3
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR CIRCUIT
Peak Reflow Temperature (Cel)
225
Operating Temperature-Max (Cel)
85
Operating Temperature-Min (Cel)
-40
Time@Peak Reflow Temperature-Max (s)
30