Integrated Device Technology, Inc. IDT70V3389S4BFI8 | 搜芯易Sourcengine

Integrated Device Technology, Inc. IDT70V3389S4BFI8

生命周期状态
Transferred
说明
Application Specific SRAM, 64KX18, 4.2ns, CMOS, PBGA208
类别
Semiconductors Memory ICs SRAMs APPLICATION SPECIFIC SRAM

ECCN
3A991.b.2.a
ECCN Governance
EAR
HTS Code
8542.32.00.41
SB Code
8542.32.00.40

I/O Type
COMMON
Technology
CMOS
JESD-30 Code
S-PBGA-B208
Memory Width
18
Package Code
FBGA
Package Shape
SQUARE
Package Style
GRID ARRAY, FINE PITCH Meter
Surface Mount
YES
Terminal Form
BALL
J-STD-609 Code
e0
Memory IC Type
APPLICATION SPECIFIC SRAM
Operating Mode
SYNCHRONOUS
Number of Ports
2
Parallel/Serial
PARALLEL
Terminal Finish
Tin/Lead (Sn63Pb37)
DLA Qualification
Not Qualified
Temperature Grade
INDUSTRIAL
Terminal Position
BOTTOM
Memory Organization
64KX18
Number of Terminals
208
Terminal Pitch (mm)
0.8
Access Time-Max (ns)
4.2
Number of Words Code
64K
Memory Density (bits)
1179648
Package Body Material
PLASTIC/EPOXY
Output Characteristics
3-STATE
Number of Words (words)
65536
Standby Current-Max (A)
0.015
Standby Voltage-Min (V)
3.15
Supply Current-Max (mA)
460
Package Equivalence Code
BGA208,17X17,32
Clock Frequency-Max (MHz)
133
Moisture Sensitivity Level
3
Peak Reflow Temperature (Cel)
225
Operating Temperature-Max (Cel)
85
Operating Temperature-Min (Cel)
-40
Time@Peak Reflow Temperature-Max (s)
20