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IBMPPC750CLGEQ9033

IBM MICROELECTRONICS

IBM MICROELECTRONICS IBMPPC750CLGEQ9033
  • ECCN
    3A991.a.2
  • ECCN Governance
    EAR
  • HTS Code
    8542.31.00.25
  • SB Code
    8542.31.00.25
  • Format
    FLOATING POINT
  • Bit Size
    32
  • Technology
    CMOS
  • Width (mm)
    21
  • Length (mm)
    21
  • Speed (MHz)
    900
  • JESD-30 Code
    S-PBGA-B278
  • Package Code
    BGA
  • Boundary Scan
    YES
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • J-STD-609 Code
    e3
  • Low Power Mode
    YES
  • Terminal Finish
    MATTE TIN
  • Integrated Cache
    YES
  • Address Bus Width
    32
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    OTHER
  • Terminal Position
    BOTTOM
  • Number of Terminals
    278
  • Terminal Pitch (mm)
    1
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    3.21
  • Supply Voltage-Max (V)
    1.25
  • Supply Voltage-Min (V)
    1.15
  • Supply Voltage-Nom (V)
    1.2
  • External Data Bus Width
    64
  • Package Equivalence Code
    BGA278,20X20,40
  • Clock Frequency-Max (MHz)
    240
  • Moisture Sensitivity Level
    1
  • uPs/uCs/Peripheral ICs Type
    MICROPROCESSOR
  • Operating Temperature-Max (Cel)
    105
  • Operating Temperature-Min (Cel)
    0

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IBMPPC750CLGEQ9033
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IBMPPC750CLGEQ9033