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IBM25PPC970FX6UR267ET

IBM MICROELECTRONICS

IBM MICROELECTRONICS IBM25PPC970FX6UR267ET
  • ECCN
    3A991.a.2
  • ECCN Governance
    EAR
  • HTS Code
    8542.31.00.30
  • SB Code
    8542.31.00.30
  • Format
    FLOATING POINT
  • Bit Size
    64
  • Technology
    CMOS
  • Width (mm)
    25
  • Length (mm)
    25
  • Speed (MHz)
    1800
  • JESD-30 Code
    S-CBGA-B576
  • Package Code
    BGA
  • Boundary Scan
    YES
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • J-STD-609 Code
    e1
  • Low Power Mode
    YES
  • Terminal Finish
    TIN SILVER COPPER
  • Integrated Cache
    YES
  • Address Bus Width
    44
  • DLA Qualification
    Not Qualified
  • Terminal Position
    BOTTOM
  • Number of Terminals
    576
  • Terminal Pitch (mm)
    1
  • Package Body Material
    CERAMIC, METAL-SEALED COFIRED
  • Seated Height-Max (mm)
    2.808
  • Supply Voltage-Max (V)
    1.2
  • Supply Voltage-Min (V)
    1.1
  • Supply Voltage-Nom (V)
    1.15
  • External Data Bus Width
    44
  • Package Equivalence Code
    BGA576,24X24,40
  • Clock Frequency-Max (MHz)
    300
  • Moisture Sensitivity Level
    3
  • uPs/uCs/Peripheral ICs Type
    MICROPROCESSOR, RISC

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IBM25PPC970FX6UR267ET
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IBM25PPC970FX6UR267ET