产品制造商
提交询价BOM 工具

IBM25PPC750L-FB0A300W

IBM MICROELECTRONICS

IBM MICROELECTRONICS IBM25PPC750L-FB0A300W
  • ECCN
    3A991.a.2
  • ECCN Governance
    EAR
  • HTS Code
    8542.31.00.25
  • SB Code
    8542.31.00.25
  • Format
    FLOATING POINT
  • Bit Size
    32
  • Technology
    CMOS
  • Width (mm)
    25
  • Length (mm)
    25
  • Speed (MHz)
    300
  • JESD-30 Code
    S-CBGA-B360
  • Package Code
    BGA
  • Boundary Scan
    YES
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • J-STD-609 Code
    e0
  • Low Power Mode
    YES
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • Integrated Cache
    YES
  • Address Bus Width
    32
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    BOTTOM
  • Number of Terminals
    360
  • Terminal Pitch (mm)
    1.27
  • Package Body Material
    CERAMIC, METAL-SEALED COFIRED
  • Seated Height-Max (mm)
    3.2
  • Supply Voltage-Max (V)
    2.1
  • Supply Voltage-Min (V)
    2
  • Supply Voltage-Nom (V)
    2.05
  • External Data Bus Width
    64
  • Package Equivalence Code
    BGA360,19X19,50
  • Clock Frequency-Max (MHz)
    100
  • uPs/uCs/Peripheral ICs Type
    MICROPROCESSOR, RISC
  • Operating Temperature-Max (Cel)
    65
  • Operating Temperature-Min (Cel)
    0

IBM25PPC750L-FB0A300W有0家供应商货源可供购买或竞价

提交询价

您的询价单将直接发送给我们的销售专家: Pari

提交询价
IBM25PPC750L-FB0A300W
提交询价
IBM25PPC750L-FB0A300W