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IBM25PPC405GP-3DD200C

IBM MICROELECTRONICS

IBM MICROELECTRONICS IBM25PPC405GP-3DD200C
  • ECCN
    3A991.a.2
  • ECCN Governance
    EAR
  • HTS Code
    8542.31.00.25
  • SB Code
    8542.31.00.25
  • Format
    FIXED POINT
  • Bit Size
    32
  • Technology
    CMOS
  • Width (mm)
    27
  • Length (mm)
    27
  • Speed (MHz)
    200
  • JESD-30 Code
    S-PBGA-B456
  • Package Code
    HBGA
  • Boundary Scan
    YES
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY, HEAT SINK/SLUG Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • J-STD-609 Code
    e0
  • Low Power Mode
    YES
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • Integrated Cache
    YES
  • Address Bus Width
    0
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    BOTTOM
  • Additional Feature
    SEATED HGT-NOM
  • Number of Terminals
    456
  • Terminal Pitch (mm)
    1
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    2.21
  • Supply Voltage-Max (V)
    2.7
  • Supply Voltage-Min (V)
    2.3
  • Supply Voltage-Nom (V)
    2.5
  • External Data Bus Width
    0
  • Package Equivalence Code
    BGA456,26X26,40
  • Clock Frequency-Max (MHz)
    66.6
  • uPs/uCs/Peripheral ICs Type
    MICROPROCESSOR, RISC
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40

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IBM25PPC405GP-3DD200C
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IBM25PPC405GP-3DD200C