IBM MICROELECTRONICS IBM25CPC700DB3A66Z | 搜芯易Sourcengine

IBM MICROELECTRONICS IBM25CPC700DB3A66Z

生命周期状态
Discontinued
说明
PCI Bus Controller, CMOS, CBGA474
类别
Semiconductors UPs/uCs/Peripheral ICs Bus Controllers BUS CONTROLLER, PCI

ECCN
3A991.a.2
ECCN Governance
EAR
HTS Code
8542.31.00.30
SB Code
8542.31.00.30

Technology
CMOS
Width (mm)
25
Length (mm)
32.5
JESD-30 Code
R-CBGA-B474
Package Code
BGA
Package Shape
RECTANGULAR
Package Style
GRID ARRAY Meter
Surface Mount
YES
Terminal Form
BALL
J-STD-609 Code
e0
Terminal Finish
Tin/Lead (Sn/Pb)
Address Bus Width
32
Bus Compatibility
POWERPC 60X; POWERPC 7XX
DLA Qualification
Not Qualified
Terminal Position
BOTTOM
Number of Terminals
474
Terminal Pitch (mm)
1.27
Package Body Material
CERAMIC, METAL-SEALED COFIRED
Seated Height-Max (mm)
3.05
Supply Voltage-Max (V)
3.465
Supply Voltage-Min (V)
3.135
Supply Voltage-Nom (V)
3.3
External Data Bus Width
64
Supply Current-Max (mA)
420
Package Equivalence Code
BGA474,19X25,50
Clock Frequency-Max (MHz)
66.66
uPs/uCs/Peripheral ICs Type
BUS CONTROLLER, PCI
Operating Temperature-Max (Cel)
105
Operating Temperature-Min (Cel)
-40