IBM MICROELECTRONICS IBM14N32724FPA-9
  • ECCN
    3A991.b.2.a
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.41
  • SB Code
    8542.32.00.40
  • I/O Type
    COMMON
  • Technology
    CMOS
  • JESD-30 Code
    R-XDMA-N160
  • Memory Width
    72
  • Package Code
    DIMM
  • Output Enable
    YES
  • Package Shape
    RECTANGULAR
  • Package Style
    MICROELECTRONIC ASSEMBLY Meter
  • Surface Mount
    NO
  • Terminal Form
    NO LEAD
  • Memory IC Type
    CACHE SRAM MODULE
  • Operating Mode
    SYNCHRONOUS
  • Number of Ports
    1
  • Parallel/Serial
    PARALLEL
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    DUAL
  • Memory Organization
    32KX72
  • Number of Functions
    1
  • Number of Terminals
    160
  • Terminal Pitch (mm)
    1.27
  • Access Time-Max (ns)
    9
  • Number of Words Code
    32K
  • Memory Density (bits)
    2359296
  • Package Body Material
    UNSPECIFIED
  • Output Characteristics
    3-STATE
  • Supply Voltage-Max (V)
    3.465
  • Supply Voltage-Min (V)
    3.135
  • Supply Voltage-Nom (V)
    3.3
  • Number of Words (words)
    32768
  • Standby Current-Max (A)
    0.1
  • Standby Voltage-Min (V)
    3.14
  • Supply Current-Max (mA)
    900
  • Package Equivalence Code
    DIMM160
  • Operating Temperature-Max (Cel)
    70
  • Operating Temperature-Min (Cel)
    0

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