产品制造商
提交询价BOM 工具

HY5RS123235BFP-18L

SK Hynix

SK Hynix HY5RS123235BFP-18L
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.28
  • SB Code
    8542.32.00.15
  • Width
    11 mm
  • Length
    14 mm
  • I/O Type
    COMMON
  • Technology
    CMOS
  • Access Mode
    MULTI BANK PAGE BURST
  • JESD-30 Code
    R-PDSO-G66
  • Memory Width
    32
  • Organization
    16MX32
  • Package Code
    TFBGA
  • Self Refresh
    YES
  • JESD-609 Code
    e1
  • Package Shape
    RECTANGULAR
  • Package Style
    SMALL OUTLINE, THIN PROFILE Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Memory Density
    536870912 bit
  • Memory IC Type
    DDR3 DRAM
  • Operating Mode
    SYNCHRONOUS
  • Refresh Cycles
    8192
  • Terminal Pitch
    0.8 mm
  • Number of Ports
    1
  • Number of Words
    16777216 words
  • Terminal Finish
    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
  • Seated Height-Max
    1.2 mm
  • Temperature Grade
    OTHER
  • Terminal Position
    DUAL
  • Additional Feature
    AUTO/SELF REFRESH
  • Supply Current-Max
    460 mA
  • Number of Functions
    1
  • Number of Terminals
    136
  • Standby Current-Max
    0.04 Amp
  • Number of Words Code
    16M
  • Qualification Status
    Not Qualified
  • Package Body Material
    PLASTIC/EPOXY
  • Output Characteristics
    3-STATE
  • Sequential Burst Length
    4,8
  • Interleaved Burst Length
    4,8
  • Package Equivalence Code
    BGA136,12X17,32
  • Operating Temperature-Max
    85 Cel
  • Operating Temperature-Min
    0 Cel
  • Supply Voltage-Max (Vsup)
    1.545 V
  • Supply Voltage-Min (Vsup)
    1.455 V
  • Supply Voltage-Nom (Vsup)
    1.5 V
  • Clock Frequency-Max (fCLK)
    550 MHz
  • Peak Reflow Temperature (Cel)
    260
  • Time@Peak Reflow Temperature-Max (s)
    20

HY5RS123235BFP-18L有0家供应商货源可供购买或竞价

提交询价

您的询价单将直接发送给我们的销售专家: Pari

提交询价
HY5RS123235BFP-18L
提交询价
HY5RS123235BFP-18L