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HY27UH08AG5M-TMB

SK Hynix

SK Hynix HY27UH08AG5M-TMB
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.51
  • SB Code
    8542.32.00.50
  • Type
    SLC NAND TYPE
  • Width
    12 mm
  • Length
    18.4 mm
  • Technology
    CMOS
  • JESD-30 Code
    R-PDSO-G48
  • Memory Width
    8
  • Organization
    2GX8
  • Package Code
    TSOP1
  • Package Shape
    RECTANGULAR
  • Package Style
    SMALL OUTLINE, THIN PROFILE Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • Memory Density
    17179869184 bit
  • Memory IC Type
    FLASH
  • Operating Mode
    ASYNCHRONOUS
  • Terminal Pitch
    0.5 mm
  • Access Time-Max
    25 ns
  • Number of Words
    2147483648 words
  • Parallel/Serial
    PARALLEL
  • Seated Height-Max
    1.2 mm
  • Temperature Grade
    OTHER
  • Terminal Position
    DUAL
  • Number of Functions
    1
  • Number of Terminals
    48
  • Programming Voltage
    3.3 V
  • Number of Words Code
    2G
  • Qualification Status
    Not Qualified
  • Package Body Material
    PLASTIC/EPOXY
  • Operating Temperature-Max
    85 Cel
  • Operating Temperature-Min
    -30 Cel
  • Supply Voltage-Max (Vsup)
    3.6 V
  • Supply Voltage-Min (Vsup)
    2.7 V
  • Supply Voltage-Nom (Vsup)
    3.3 V
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Time@Peak Reflow Temperature-Max (s)
    NOT SPECIFIED

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