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HY27UG088GDM-UPCP

SK Hynix

SK Hynix HY27UG088GDM-UPCP
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.51
  • SB Code
    8542.32.00.50
  • Type
    SLC NAND TYPE
  • Width
    12 mm
  • Length
    17 mm
  • Page Size
    2K words
  • Ready/Busy
    YES
  • Technology
    CMOS
  • Toggle Bit
    NO
  • Sector Size
    128K Words
  • Data Polling
    NO
  • JESD-30 Code
    R-PBGA-B52
  • Memory Width
    8
  • Organization
    1GX8
  • Package Code
    VBGA
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY, VERY THIN PROFILE Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Memory Density
    8589934592 bit
  • Memory IC Type
    FLASH
  • Operating Mode
    ASYNCHRONOUS
  • Terminal Pitch
    1 mm
  • Access Time-Max
    25 ns
  • Number of Words
    1073741824 words
  • Parallel/Serial
    PARALLEL
  • Seated Height-Max
    0.65 mm
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    BOTTOM
  • Additional Feature
    CONTAINS ADDITIONAL 512M BIT SPARE MEMORY
  • Supply Current-Max
    30 mA
  • Number of Functions
    1
  • Number of Terminals
    52
  • Programming Voltage
    3.3 V
  • Standby Current-Max
    0.0001 Amp
  • Number of Words Code
    1G
  • Qualification Status
    Not Qualified
  • Package Body Material
    PLASTIC/EPOXY
  • Command User Interface
    YES
  • Number of Sectors/Size
    8K
  • Package Equivalence Code
    LGA52(UNSPEC)
  • Operating Temperature-Max
    70 Cel
  • Operating Temperature-Min
    0 Cel
  • Supply Voltage-Max (Vsup)
    3.6 V
  • Supply Voltage-Min (Vsup)
    2.7 V
  • Supply Voltage-Nom (Vsup)
    3.3 V
  • Peak Reflow Temperature (Cel)
    260
  • Time@Peak Reflow Temperature-Max (s)
    20

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