Kingston Technology Company, Inc. HX324C11PB3K2/16 | 搜芯易Sourcengine

Kingston Technology Company, Inc. HX324C11PB3K2/16

生命周期状态
Discontinued
说明
DDR DRAM Module, 1GX64, CMOS
类别
Semiconductors Memory ICs DRAMs DDR DRAM MODULE

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8473.30.11.40
SB Code
8542.32.00.23

Technology
CMOS
Width (mm)
8.3
Access Mode
MULTI BANK PAGE BURST
Length (mm)
133.35
JESD-30 Code
R-XDMA-N240
Memory Width
64
Package Code
DIMM
Self Refresh
YES
Package Shape
RECTANGULAR
Package Style
MICROELECTRONIC ASSEMBLY Meter
Surface Mount
NO
Terminal Form
NO LEAD
Memory IC Type
DDR DRAM MODULE
Operating Mode
SYNCHRONOUS
Number of Ports
1
Temperature Grade
OTHER
Terminal Position
DUAL
Additional Feature
AUTO/SELF REFRESH; SEATED HGT-NOM
Memory Organization
1GX64
Number of Functions
2
Number of Terminals
240
Number of Words Code
1G
Memory Density (bits)
68719476736
Package Body Material
UNSPECIFIED
Seated Height-Max (mm)
41
Supply Voltage-Max (V)
1.575
Supply Voltage-Min (V)
1.425
Supply Voltage-Nom (V)
1.5
Number of Words (words)
1073741824
Operating Temperature-Max (Cel)
85
Operating Temperature-Min (Cel)
0