Kingston Technology Company, Inc. HX316LS9IBK2/8 | 搜芯易Sourcengine

Kingston Technology Company, Inc. HX316LS9IBK2/8

生命周期状态
Discontinued
说明
DDR3L DRAM Module, 512MX64, CMOS
类别
Semiconductors Memory ICs DRAMs DDR3L DRAM MODULE

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8473.30.11.40
SB Code
8542.32.00.23

Technology
CMOS
Access Mode
MULTI BANK PAGE BURST
Length (mm)
67.6
JESD-30 Code
R-XDMA-N204
Memory Width
64
Package Code
DIMM
Self Refresh
NO
Package Shape
RECTANGULAR
Package Style
MICROELECTRONIC ASSEMBLY Meter
Surface Mount
NO
Terminal Form
NO LEAD
Memory IC Type
DDR3L DRAM MODULE
Operating Mode
SYNCHRONOUS
Number of Ports
1
Temperature Grade
OTHER
Terminal Position
DUAL
Additional Feature
ALSO OPERATES AT 1.5V ; PROGRAMMABLE CAS LATENCY
Memory Organization
512MX64
Number of Functions
2
Number of Terminals
204
Number of Words Code
512M
Memory Density (bits)
34359738368
Package Body Material
UNSPECIFIED
Seated Height-Max (mm)
30.13
Supply Voltage-Max (V)
1.45
Supply Voltage-Min (V)
1.28
Supply Voltage-Nom (V)
1.35
Number of Words (words)
536870912
Sequential Burst Length
4,8
Standby Voltage-Min (V)
1.28
Interleaved Burst Length
4,8
Operating Temperature-Max (Cel)
85
Operating Temperature-Min (Cel)
0