HX316LS9IBK2/16
Kingston Technology Company, Inc.
- 生命周期状态Discontinued
- 说明DDR3L DRAM Module, 1GX64, CMOS
- 类别
- ECCNEAR99
- ECCN GovernanceEAR
- HTS Code8473.30.11.40
- SB Code8542.32.00.23
- Length67.6 mm
- TechnologyCMOS
- Access ModeMULTI BANK PAGE BURST
- JESD-30 CodeR-XDMA-N204
- Memory Width64
- Organization1GX64
- Package CodeDIMM
- Self RefreshNO
- Package ShapeRECTANGULAR
- Package StyleMICROELECTRONIC ASSEMBLY Meter
- Surface MountNO
- Terminal FormNO LEAD
- Memory Density68719476736 bit
- Memory IC TypeDDR3L DRAM MODULE
- Operating ModeSYNCHRONOUS
- Number of Ports1
- Number of Words1073741824 words
- Seated Height-Max30 mm
- Temperature GradeOTHER
- Terminal PositionDUAL
- Additional FeatureALSO OPERATES AT 1.5V ; PROGRAMMABLE CAS LATENCY; SEATED HGT-NOM
- Number of Functions2
- Number of Terminals204
- Standby Voltage-Min1.28 V
- Number of Words Code1G
- Package Body MaterialUNSPECIFIED
- Sequential Burst Length4,8
- Interleaved Burst Length4,8
- Operating Temperature-Max85 Cel
- Operating Temperature-Min0 Cel
- Supply Voltage-Max (Vsup)1.45 V
- Supply Voltage-Min (Vsup)1.28 V
- Supply Voltage-Nom (Vsup)1.35 V
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HX316LS9IBK2/16