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HT23C256(28DIP)

Holtek Semiconductor Inc.

Holtek Semiconductor Inc. HT23C256(28DIP)
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.71
  • SB Code
    8542.32.00.70
  • Technology
    CMOS
  • JESD-30 Code
    R-PDIP-T28
  • Memory Width
    8
  • Organization
    32KX8
  • Package Code
    DIP
  • Package Shape
    RECTANGULAR
  • Package Style
    IN-LINE Meter
  • Surface Mount
    NO
  • Terminal Form
    THROUGH-HOLE
  • Memory Density
    262144 bit
  • Memory IC Type
    MASK ROM
  • Access Time-Max
    250 ns
  • Number of Words
    32768 words
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    DUAL
  • Supply Current-Max
    25 mA
  • Number of Terminals
    28
  • Standby Current-Max
    0.0015 Amp
  • Number of Words Code
    32K
  • Qualification Status
    Not Qualified
  • Package Body Material
    PLASTIC/EPOXY
  • Package Equivalence Code
    DIP28(UNSPEC)
  • Operating Temperature-Max
    85 Cel
  • Operating Temperature-Min
    -40 Cel

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HT23C256(28DIP)
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HT23C256(28DIP)