SK Hynix HMT125S6AFP8C-G7 | 搜芯易Sourcengine

SK Hynix HMT125S6AFP8C-G7

生命周期状态
Discontinued
RoHS
符合RoHS标准
说明
DDR3 DRAM Module, 256MX8, CMOS
类别
Semiconductors Memory ICs DRAMs DDR3 DRAM MODULE

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8542.32.00.36
SB Code
8542.32.00.23

Technology
CMOS
Width (mm)
3.8
Access Mode
DUAL BANK PAGE BURST
Length (mm)
67.6
JESD-30 Code
R-XDMA-N240
Memory Width
8
Package Code
DIMM
Self Refresh
YES
Package Shape
RECTANGULAR
Package Style
MICROELECTRONIC ASSEMBLY Meter
Surface Mount
NO
Terminal Form
NO LEAD
Memory IC Type
DDR3 DRAM MODULE
Operating Mode
SYNCHRONOUS
Refresh Cycles
8192
Number of Ports
1
DLA Qualification
Not Qualified
Temperature Grade
OTHER
Terminal Position
DUAL
Additional Feature
AUTO/SELF REFRESH; SEATED HGT-NOM; WD-MAX
Memory Organization
256MX8
Number of Functions
1
Number of Terminals
203
Terminal Pitch (mm)
0.6
Number of Words Code
256M
Memory Density (bits)
2147483648
Package Body Material
UNSPECIFIED
Seated Height-Max (mm)
30
Supply Voltage-Max (V)
1.575
Supply Voltage-Min (V)
1.425
Supply Voltage-Nom (V)
1.5
Number of Words (words)
268435456
Standby Current-Max (A)
0.16
Supply Current-Max (mA)
2480
Package Equivalence Code
DIMM204,24
Peak Reflow Temperature (Cel)
260
Operating Temperature-Max (Cel)
85
Operating Temperature-Min (Cel)
0
Time@Peak Reflow Temperature-Max (s)
20