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HEF4508BPN

PHILIPS SEMICONDUCTORS

PHILIPS SEMICONDUCTORS HEF4508BPN
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.39.00.00
  • Technology
    CMOS
  • JESD-30 Code
    R-PDIP-T24
  • Package Code
    DIP
  • Logic IC Type
    D LATCH
  • Package Shape
    RECTANGULAR
  • Package Style
    IN-LINE Meter
  • Surface Mount
    NO
  • Terminal Form
    THROUGH-HOLE
  • J-STD-609 Code
    e0
  • Number of Bits
    4
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    DUAL
  • Number of Functions
    2
  • Number of Terminals
    24
  • Terminal Pitch (mm)
    2.54
  • Load Capacitance (pF)
    50
  • Package Body Material
    PLASTIC/EPOXY
  • Output Characteristics
    3-STATE
  • Package Equivalence Code
    DIP24,.6
  • Output Low Current-Max (mA)
    0.36
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40
  • Propagation Delay-Max@Nom-Sup (ns)
    230

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HEF4508BPN