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H5DU2562GFR-E3I

SK Hynix

SK Hynix H5DU2562GFR-E3I
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.24
  • SB Code
    8542.32.00.15
  • Width
    8 mm
  • Length
    12 mm
  • I/O Type
    COMMON
  • Technology
    CMOS
  • Access Mode
    FOUR BANK PAGE BURST
  • JESD-30 Code
    R-PBGA-B60
  • Memory Width
    16
  • Organization
    16MX16
  • Package Code
    VBGA
  • Self Refresh
    YES
  • JESD-609 Code
    e1
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY, VERY THIN PROFILE Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Memory Density
    268435456 bit
  • Memory IC Type
    DDR1 DRAM
  • Operating Mode
    SYNCHRONOUS
  • Refresh Cycles
    8192
  • Terminal Pitch
    1 mm
  • Access Time-Max
    0.7 ns
  • Number of Ports
    1
  • Number of Words
    16777216 words
  • Terminal Finish
    Tin/Silver/Copper (Sn/Ag/Cu)
  • Seated Height-Max
    1 mm
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    BOTTOM
  • Additional Feature
    AUTO/SELF REFRESH
  • Supply Current-Max
    210 mA
  • Number of Functions
    1
  • Number of Terminals
    60
  • Standby Current-Max
    0.004 Amp
  • Number of Words Code
    16M
  • Qualification Status
    Not Qualified
  • Package Body Material
    PLASTIC/EPOXY
  • Output Characteristics
    3-STATE
  • Sequential Burst Length
    2,4,8
  • Interleaved Burst Length
    2,4,8
  • Package Equivalence Code
    BGA60,9X12,40/32
  • Operating Temperature-Max
    85 Cel
  • Operating Temperature-Min
    -40 Cel
  • Supply Voltage-Max (Vsup)
    2.7 V
  • Supply Voltage-Min (Vsup)
    2.3 V
  • Supply Voltage-Nom (Vsup)
    2.5 V
  • Clock Frequency-Max (fCLK)
    200 MHz
  • Peak Reflow Temperature (Cel)
    260
  • Time@Peak Reflow Temperature-Max (s)
    20

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