产品制造商
提交询价BOM 工具

H57V1262GFR-60C

SK Hynix

SK Hynix H57V1262GFR-60C
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.02
  • SB Code
    8542.32.00.15
  • Width
    8 mm
  • Length
    8 mm
  • I/O Type
    COMMON
  • Technology
    CMOS
  • Access Mode
    FOUR BANK PAGE BURST
  • JESD-30 Code
    S-PBGA-B54
  • Memory Width
    16
  • Organization
    2MX16
  • Package Code
    VFBGA
  • Self Refresh
    YES
  • JESD-609 Code
    e1
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY, VERY THIN PROFILE, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Memory Density
    33554432 bit
  • Memory IC Type
    SYNCHRONOUS DRAM
  • Operating Mode
    SYNCHRONOUS
  • Refresh Cycles
    4096
  • Terminal Pitch
    0.8 mm
  • Access Time-Max
    5.4 ns
  • Number of Ports
    1
  • Number of Words
    2097152 words
  • Terminal Finish
    Tin/Silver/Copper (Sn/Ag/Cu)
  • Seated Height-Max
    1 mm
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    BOTTOM
  • Additional Feature
    AUTO/SELF REFRESH
  • Supply Current-Max
    200 mA
  • Number of Functions
    1
  • Number of Terminals
    54
  • Standby Current-Max
    0.002 Amp
  • Number of Words Code
    2M
  • Qualification Status
    Not Qualified
  • Package Body Material
    PLASTIC/EPOXY
  • Output Characteristics
    3-STATE
  • Sequential Burst Length
    1,2,4,8,FP
  • Interleaved Burst Length
    1,2,4,8
  • Package Equivalence Code
    BGA54,9X9,32
  • Operating Temperature-Max
    70 Cel
  • Operating Temperature-Min
    0 Cel
  • Supply Voltage-Max (Vsup)
    3.6 V
  • Supply Voltage-Min (Vsup)
    3 V
  • Supply Voltage-Nom (Vsup)
    3.3 V
  • Clock Frequency-Max (fCLK)
    166 MHz
  • Peak Reflow Temperature (Cel)
    260
  • Time@Peak Reflow Temperature-Max (s)
    20

H57V1262GFR-60C有0家供应商货源可供购买或竞价

提交询价

您的询价单将直接发送给我们的销售专家: Pari

提交询价
H57V1262GFR-60C
提交询价
H57V1262GFR-60C