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FT900L-T

Future Technology Devices International Ltd.

Future Technology Devices International Ltd. FT900L-T
  • HTS Code
    8542.31.00.01
  • SB Code
    8542.31.00.25
  • Bit Size
    32
  • Technology
    CMOS
  • Width (mm)
    14
  • Length (mm)
    14
  • Peripherals
    POR, PWM(7), RTC, TIMER(4), WDT
  • Speed (MHz)
    100
  • ADC Channels
    YES
  • Connectivity
    CAN(2), ETHERNET, I2C(2), I2S, SDHC, SPI(3), UART(2), USB(2)
  • DAC Channels
    YES
  • DMA Channels
    NO
  • JESD-30 Code
    S-PQFP-G100
  • PWM Channels
    YES
  • Package Code
    LFQFP
  • Package Shape
    SQUARE
  • Package Style
    FLATPACK, LOW PROFILE, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • A/D Converters
    7-Ch 10-Bit
  • D/A Converters
    2-Ch 10-Bit
  • Address Bus Width
    0
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    QUAD
  • Number of I/O Lines
    66
  • Number of Terminals
    100
  • Program Memory Type
    FLASH
  • Terminal Pitch (mm)
    0.5
  • Data RAM Size (bytes)
    65536
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    1.6
  • Supply Voltage-Nom (V)
    3.3
  • External Data Bus Width
    0
  • Data EEPROM Size (bytes)
    0
  • Program Memory Size (words)
    262144
  • Program Memory Width (bits)
    8
  • uPs/uCs/Peripheral ICs Type
    MICROCONTROLLER, RISC
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40
  • Time@Peak Reflow Temperature-Max (s)
    NOT SPECIFIED

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FT900L-T
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FT900L-T