产品制造商
提交询价BOM 工具

FNNB16A1T1KDMAFJ4-AS

Micron Technology

Micron Technology FNNB16A1T1KDMAFJ4-AS
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.51
  • SB Code
    8542.32.00.50
  • Type
    TLC NAND TYPE
  • Ready/Busy
    YES
  • Technology
    CMOS
  • Toggle Bit
    YES
  • Width (mm)
    12
  • Length (mm)
    18
  • Data Polling
    YES
  • JESD-30 Code
    R-PBGA-B132
  • Memory Width
    8
  • Package Code
    VBGA
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY, VERY THIN PROFILE Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Memory IC Type
    FLASH
  • Operating Mode
    ASYNCHRONOUS
  • Parallel/Serial
    PARALLEL
  • Page Size (words)
    16K
  • Terminal Position
    BOTTOM
  • Memory Organization
    128GX8
  • Number of Functions
    1
  • Number of Terminals
    132
  • Sector Size (words)
    36K
  • Terminal Pitch (mm)
    1
  • Access Time-Max (ns)
    25
  • Number of Words Code
    128G
  • Memory Density (bits)
    1099511627776
  • Package Body Material
    PLASTIC/EPOXY
  • Command User Interface
    YES
  • Number of Sectors/Size
    4032
  • Output Characteristics
    3-STATE
  • Seated Height-Max (mm)
    1
  • Supply Voltage-Max (V)
    3.6
  • Supply Voltage-Min (V)
    2.7
  • Supply Voltage-Nom (V)
    3.3
  • Number of Words (words)
    137438953472
  • Programming Voltage (V)
    12
  • Standby Current-Max (A)
    0.00035
  • Supply Current-Max (mA)
    52
  • Package Equivalence Code
    BGA132,11X17,40
  • Endurance (Write/Erase Cycles)
    10000
  • Operating Temperature-Max (Cel)
    70
  • Operating Temperature-Min (Cel)
    -10
  • Write Cycle Time-Max (tWC) (ms)
    25

FNNB16A1T1KDMAFJ4-AS有0家供应商货源可供购买或竞价

提交询价

您的询价单将直接发送给我们的销售专家: Pari

提交询价
FNNB16A1T1KDMAFJ4-AS
提交询价
FNNB16A1T1KDMAFJ4-AS