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EM636165BE-8G

Etron Technology Inc.

Etron Technology Inc. EM636165BE-8G
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.02
  • SB Code
    8542.32.00.15
  • I/O Type
    COMMON
  • Technology
    CMOS
  • JESD-30 Code
    R-PBGA-B60
  • Memory Width
    16
  • Organization
    1MX16
  • Package Code
    FBGA
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Memory Density
    16777216 bit
  • Memory IC Type
    SYNCHRONOUS DRAM
  • Refresh Cycles
    4096
  • Terminal Pitch
    0.635 mm
  • Access Time-Max
    6.5 ns
  • Number of Words
    1048576 words
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    BOTTOM
  • Supply Current-Max
    130 mA
  • Number of Terminals
    60
  • Standby Current-Max
    0.002 Amp
  • Number of Words Code
    1M
  • Qualification Status
    Not Qualified
  • Package Body Material
    PLASTIC/EPOXY
  • Output Characteristics
    3-STATE
  • Sequential Burst Length
    1,2,4,8,FP
  • Interleaved Burst Length
    1,2,4,8
  • Package Equivalence Code
    BGA60,7X15,25
  • Operating Temperature-Max
    70 Cel
  • Operating Temperature-Min
    0 Cel
  • Supply Voltage-Nom (Vsup)
    3.3 V
  • Clock Frequency-Max (fCLK)
    125 MHz

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EM636165BE-8G
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EM636165BE-8G