ADVANCED INTERCONNECTIONS CORP EKS3303-282TG9 | 搜芯易Sourcengine

ADVANCED INTERCONNECTIONS CORP EKS3303-282TG9

生命周期状态
Discontinued
说明
IC Socket, DIP30, 30 Contact(s), 7.62mm Term Pitch, 7.62mm Row Spacing, Solder
类别
Interconnects Sockets and Chip Carriers

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8536.69.40.40
SB Code
8536.69.40.40

Contact Style
RND PIN-SKT
J-STD-609 Code
e0
Mounting Style
STRAIGHT
Housing Material
POLYIMIDE
Termination Type
SOLDER
Device Socket Type
IC SOCKET
Number of Contacts
30
Device Type Used On
DIP30
PCB Contact Pattern
RECTANGULAR
Terminal Pitch (mm)
7.62
Contact Configuration
RECTANGLE
Socket Body Depth (inch)
0.155
Contact Finish - Termination
TIN LEAD OVER NICKEL
PCB Contact Row Spacing (mm)
7.62