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EDI8L32128C20AI

Microsemi Corporation

Microsemi Corporation EDI8L32128C20AI
  • ECCN
    3A991.b.2.a
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.41
  • SB Code
    8542.32.00.40
  • Technology
    CMOS
  • Width (mm)
    24.2824
  • Length (mm)
    24.2824
  • JESD-30 Code
    S-PQCC-J68
  • Memory Width
    32
  • Package Code
    QCCJ
  • Package Shape
    SQUARE
  • Package Style
    CHIP CARRIER Meter
  • Surface Mount
    YES
  • Terminal Form
    J BEND
  • Memory IC Type
    SRAM MODULE
  • Operating Mode
    ASYNCHRONOUS
  • Parallel/Serial
    PARALLEL
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    QUAD
  • Additional Feature
    ALSO CONFIGURABLE AS 512K X 8; LG-MAX; WD-MAX
  • Memory Organization
    128KX32
  • Number of Functions
    1
  • Number of Terminals
    68
  • Terminal Pitch (mm)
    1.27
  • Access Time-Max (ns)
    20
  • Number of Words Code
    128K
  • Memory Density (bits)
    4194304
  • Package Body Material
    PLASTIC/EPOXY
  • Alternate Memory Width
    16
  • Seated Height-Max (mm)
    4.572
  • Supply Voltage-Max (V)
    5.25
  • Supply Voltage-Min (V)
    4.75
  • Supply Voltage-Nom (V)
    5
  • Number of Words (words)
    131072
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40
  • Time@Peak Reflow Temperature-Max (s)
    NOT SPECIFIED

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