DPAC TECHNOLOGIES CORP DPZ512X16IH3-17I | 搜芯易Sourcengine

DPAC TECHNOLOGIES CORP DPZ512X16IH3-17I

生命周期状态
Transferred
说明
Flash Module, 512KX16, 170ns
类别
Semiconductors Memory ICs Flash Memories FLASH MODULE

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8542.32.00.51
SB Code
8542.32.00.50

Type
NOR TYPE
Technology
MOS
Toggle Bit
NO
Data Polling
NO
JESD-30 Code
R-XQFP-G48
Memory Width
16
Package Code
AQFP
Package Shape
RECTANGULAR
Package Style
FLATPACK, PIGGYBACK Meter
Surface Mount
YES
Terminal Form
GULL WING
J-STD-609 Code
e0
Memory IC Type
FLASH MODULE
Operating Mode
ASYNCHRONOUS
Parallel/Serial
PARALLEL
Terminal Finish
Tin/Lead (Sn/Pb)
DLA Qualification
Not Qualified
Temperature Grade
INDUSTRIAL
Terminal Position
QUAD
Memory Organization
512KX16
Number of Functions
1
Number of Terminals
48
Terminal Pitch (mm)
1.27
Access Time-Max (ns)
170
Number of Words Code
512K
Memory Density (bits)
8388608
Package Body Material
UNSPECIFIED
Alternate Memory Width
8
Output Characteristics
3-STATE
Seated Height-Max (mm)
9.1948
Supply Voltage-Max (V)
5.5
Supply Voltage-Min (V)
4.5
Supply Voltage-Nom (V)
5
Number of Words (words)
524288
Programming Voltage (V)
12
Standby Current-Max (A)
0.0008
Supply Current-Max (mA)
70
Package Equivalence Code
QFP48,.7X1.1,50
Operating Temperature-Max (Cel)
85
Operating Temperature-Min (Cel)
-40