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DPZ2MX8A3-20B

DPAC TECHNOLOGIES CORP

DPAC TECHNOLOGIES CORP DPZ2MX8A3-20B
  • ECCN
    3A001.a.2.c
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.51
  • SB Code
    8542.32.00.50
  • Type
    NOR TYPE
  • Technology
    CMOS
  • Toggle Bit
    NO
  • Data Polling
    NO
  • JESD-30 Code
    R-XPGA-P50
  • Memory Width
    8
  • Package Code
    PGA
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    NO
  • Terminal Form
    PIN/PEG
  • J-STD-609 Code
    e0
  • Memory IC Type
    FLASH MODULE
  • Parallel/Serial
    PARALLEL
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    MILITARY
  • Terminal Position
    PERPENDICULAR
  • Memory Organization
    2MX8
  • Number of Terminals
    50
  • Terminal Pitch (mm)
    2.54
  • Access Time-Max (ns)
    200
  • Number of Words Code
    2M
  • Memory Density (bits)
    16777216
  • Package Body Material
    CERAMIC
  • Supply Voltage-Nom (V)
    5
  • Number of Words (words)
    2097152
  • Standby Current-Max (A)
    0.0032
  • Supply Current-Max (mA)
    65
  • Package Equivalence Code
    PGA50,5X10
  • Operating Temperature-Max (Cel)
    125
  • Operating Temperature-Min (Cel)
    -55
  • Screening Level / Reference Standard
    MIL-STD-883 Class B (Modified)

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DPZ2MX8A3-20B
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DPZ2MX8A3-20B