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DPZ256X16IJ3-25B

DPAC TECHNOLOGIES CORP

DPAC TECHNOLOGIES CORP DPZ256X16IJ3-25B
  • ECCN
    3A001.a.2.c
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.51
  • SB Code
    8542.32.00.50
  • Type
    NOR TYPE
  • Technology
    MOS
  • Toggle Bit
    NO
  • Data Polling
    NO
  • JESD-30 Code
    R-XQMA-J48
  • Memory Width
    16
  • Package Code
    AQCCJ
  • Package Shape
    RECTANGULAR
  • Package Style
    CHIP CARRIER, PIGGYBACK Meter
  • Surface Mount
    YES
  • Terminal Form
    J BEND
  • J-STD-609 Code
    e0
  • Memory IC Type
    FLASH MODULE
  • Operating Mode
    ASYNCHRONOUS
  • Parallel/Serial
    PARALLEL
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    MILITARY
  • Terminal Position
    QUAD
  • Memory Organization
    256KX16
  • Number of Functions
    1
  • Number of Terminals
    48
  • Terminal Pitch (mm)
    1.27
  • Access Time-Max (ns)
    250
  • Number of Words Code
    256K
  • Memory Density (bits)
    4194304
  • Package Body Material
    UNSPECIFIED
  • Alternate Memory Width
    8
  • Output Characteristics
    3-STATE
  • Seated Height-Max (mm)
    5.842
  • Supply Voltage-Max (V)
    5.5
  • Supply Voltage-Min (V)
    4.5
  • Supply Voltage-Nom (V)
    5
  • Number of Words (words)
    262144
  • Programming Voltage (V)
    12
  • Standby Current-Max (A)
    0.0004
  • Supply Current-Max (mA)
    65
  • Package Equivalence Code
    LDCC48,.51X.88
  • Operating Temperature-Max (Cel)
    125
  • Operating Temperature-Min (Cel)
    -55
  • Screening Level / Reference Standard
    MIL-STD-883 Class B (Modified)

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DPZ256X16IJ3-25B