DPAC TECHNOLOGIES CORP DPZ1MX8NA3-10B | 搜芯易Sourcengine

DPAC TECHNOLOGIES CORP DPZ1MX8NA3-10B

生命周期状态
Discontinued
说明
Flash Module, 1MX8, 100ns, CPGA50
类别
Semiconductors Memory ICs Flash Memories FLASH MODULE

ECCN
3A001.a.2.c
ECCN Governance
EAR
HTS Code
8542.32.00.51
SB Code
8542.32.00.50

Type
NOR TYPE
Technology
CMOS
Width (mm)
13.716
Length (mm)
25.146
JESD-30 Code
R-CPGA-P50
Memory Width
8
Package Code
APGA
Package Shape
RECTANGULAR
Package Style
GRID ARRAY, PIGGYBACK Meter
Surface Mount
NO
Terminal Form
PIN/PEG
Memory IC Type
FLASH MODULE
Operating Mode
ASYNCHRONOUS
Parallel/Serial
PARALLEL
DLA Qualification
Not Qualified
Temperature Grade
MILITARY
Terminal Position
PERPENDICULAR
Additional Feature
AUTOMATIC WRITE
Memory Organization
1MX8
Number of Functions
1
Number of Terminals
50
Terminal Pitch (mm)
2.54
Access Time-Max (ns)
100
Number of Words Code
1M
Memory Density (bits)
8388608
Package Body Material
CERAMIC, METAL-SEALED COFIRED
Output Characteristics
3-STATE
Seated Height-Max (mm)
5.207
Supply Voltage-Max (V)
5.5
Supply Voltage-Min (V)
4.5
Supply Voltage-Nom (V)
5
Number of Words (words)
1048576
Programming Voltage (V)
12
Operating Temperature-Max (Cel)
125
Operating Temperature-Min (Cel)
-55