DPAC TECHNOLOGIES CORP DPV3232V-200M | 搜芯易Sourcengine

DPAC TECHNOLOGIES CORP DPV3232V-200M

生命周期状态
Transferred
说明
UVPROM Module, 128KX8, 200ns, CMOS, CPGA66
类别
Semiconductors Memory ICs EPROMs UVPROM MODULE

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8542.32.00.61
SB Code
8542.32.00.60

I/O Type
COMMON
Technology
CMOS
JESD-30 Code
S-CPGA-P66
Memory Width
8
Package Code
PGA
Package Shape
SQUARE
Package Style
GRID ARRAY Meter
Surface Mount
NO
Terminal Form
PIN/PEG
J-STD-609 Code
e0
Memory IC Type
UVPROM MODULE
Operating Mode
ASYNCHRONOUS
Parallel/Serial
PARALLEL
Terminal Finish
Tin/Lead (Sn/Pb)
DLA Qualification
Not Qualified
Temperature Grade
MILITARY
Terminal Position
PERPENDICULAR
Additional Feature
CONFIGURABLE AS 32K X 32
Memory Organization
128KX8
Number of Functions
1
Number of Terminals
66
Terminal Pitch (mm)
2.54
Access Time-Max (ns)
200
Number of Words Code
128K
Memory Density (bits)
1048576
Package Body Material
CERAMIC, METAL-SEALED COFIRED
Alternate Memory Width
16
Output Characteristics
3-STATE
Seated Height-Max (mm)
8.382
Supply Voltage-Max (V)
5.5
Supply Voltage-Min (V)
4.5
Supply Voltage-Nom (V)
5
Number of Words (words)
131072
Standby Current-Max (A)
0.0012
Supply Current-Max (mA)
280
Package Equivalence Code
PGA66,11X11
Operating Temperature-Max (Cel)
125
Operating Temperature-Min (Cel)
-55