DPAC TECHNOLOGIES CORP DPV256X32V-25B | 搜芯易Sourcengine

DPAC TECHNOLOGIES CORP DPV256X32V-25B

生命周期状态
Transferred
说明
UVPROM Module, 512KX16, 250ns, CMOS, CPGA66
类别
Semiconductors Memory ICs EPROMs UVPROM MODULE

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8542.32.00.61
SB Code
8542.32.00.60

I/O Type
COMMON
Technology
CMOS
Width (mm)
27.3
Length (mm)
27.3
JESD-30 Code
S-CPGA-P66
Memory Width
16
Package Code
PGA
Package Shape
SQUARE
Package Style
GRID ARRAY Meter
Surface Mount
NO
Terminal Form
PIN/PEG
J-STD-609 Code
e0
Memory IC Type
UVPROM MODULE
Operating Mode
ASYNCHRONOUS
Parallel/Serial
PARALLEL
Terminal Finish
Tin/Lead (Sn/Pb)
DLA Qualification
Not Qualified
Temperature Grade
MILITARY
Terminal Position
PERPENDICULAR
Additional Feature
CONFIGURABLE AS 256K X 32
Memory Organization
512KX16
Number of Functions
1
Number of Terminals
66
Terminal Pitch (mm)
2.54
Access Time-Max (ns)
250
Number of Words Code
512K
Memory Density (bits)
8388608
Package Body Material
CERAMIC, METAL-SEALED COFIRED
Alternate Memory Width
8
Output Characteristics
3-STATE
Seated Height-Max (mm)
8.382
Supply Voltage-Max (V)
5.5
Supply Voltage-Min (V)
4.5
Supply Voltage-Nom (V)
5
Number of Words (words)
524288
Standby Current-Max (A)
0.0004
Supply Current-Max (mA)
240
Package Equivalence Code
PGA66,11X11
Operating Temperature-Max (Cel)
125
Operating Temperature-Min (Cel)
-55
Screening Level / Reference Standard
MIL-STD-883 Class B (Modified)