DPAC TECHNOLOGIES CORP DPS512X32MXP-17CI | 搜芯易Sourcengine

DPAC TECHNOLOGIES CORP DPS512X32MXP-17CI

生命周期状态
Transferred
说明
SRAM Module, 2MX8, 17ns, CMOS
类别
Semiconductors Memory ICs SRAMs SRAM MODULE

ECCN
3A991.b.2.a
ECCN Governance
EAR
HTS Code
8542.32.00.41
SB Code
8542.32.00.40

I/O Type
COMMON
Technology
CMOS
JESD-30 Code
S-XQMA-J68
Memory Width
8
Package Code
QCCN
Package Shape
SQUARE
Package Style
MICROELECTRONIC ASSEMBLY Meter
Surface Mount
YES
Terminal Form
J BEND
J-STD-609 Code
e0
Memory IC Type
SRAM MODULE
Operating Mode
ASYNCHRONOUS
Parallel/Serial
PARALLEL
Terminal Finish
Tin/Lead (Sn/Pb)
DLA Qualification
Not Qualified
Temperature Grade
INDUSTRIAL
Terminal Position
QUAD
Additional Feature
CONFIGURABLE AS 1M X 16 OR 512K X 32
Memory Organization
2MX8
Number of Functions
1
Number of Terminals
68
Terminal Pitch (mm)
1
Access Time-Max (ns)
17
Number of Words Code
2M
Memory Density (bits)
16777216
Package Body Material
UNSPECIFIED
Output Characteristics
3-STATE
Supply Voltage-Max (V)
5.5
Supply Voltage-Min (V)
4.5
Supply Voltage-Nom (V)
5
Number of Words (words)
2097152
Standby Current-Max (A)
0.04
Standby Voltage-Min (V)
4.5
Supply Current-Max (mA)
800
Package Equivalence Code
LCC68,.55X.97,40
Operating Temperature-Max (Cel)
85
Operating Temperature-Min (Cel)
-40