DPAC TECHNOLOGIES CORP DPS512X16BH3-20C | 搜芯易Sourcengine

DPAC TECHNOLOGIES CORP DPS512X16BH3-20C

生命周期状态
Transferred
说明
SRAM Module, 1MX8, 20ns, CMOS, CQFP48
类别
Semiconductors Memory ICs SRAMs SRAM MODULE

ECCN
3A991.b.2.a
ECCN Governance
EAR
HTS Code
8542.32.00.41
SB Code
8542.32.00.40

Technology
CMOS
JESD-30 Code
R-CQFP-G48
Memory Width
8
Package Code
AQFP
Output Enable
YES
Package Shape
RECTANGULAR
Package Style
FLATPACK, PIGGYBACK Meter
Surface Mount
YES
Terminal Form
GULL WING
Memory IC Type
SRAM MODULE
Operating Mode
ASYNCHRONOUS
Number of Ports
1
Parallel/Serial
PARALLEL
DLA Qualification
Not Qualified
Temperature Grade
COMMERCIAL
Terminal Position
QUAD
Additional Feature
USER CONFIGURABLE AS 512K X 16
Memory Organization
1MX8
Number of Functions
1
Number of Terminals
48
Terminal Pitch (mm)
1.27
Access Time-Max (ns)
20
Number of Words Code
1M
Memory Density (bits)
8388608
Package Body Material
CERAMIC, METAL-SEALED COFIRED
Output Characteristics
3-STATE
Seated Height-Max (mm)
18.2372
Supply Voltage-Max (V)
5.5
Supply Voltage-Min (V)
4.5
Supply Voltage-Nom (V)
5
Number of Words (words)
1048576
Standby Voltage-Min (V)
2
Operating Temperature-Max (Cel)
70
Operating Temperature-Min (Cel)
0