DPAC TECHNOLOGIES CORP DPS512X16BA3-30B | 搜芯易Sourcengine

DPAC TECHNOLOGIES CORP DPS512X16BA3-30B

生命周期状态
Transferred
说明
SRAM Module, 1MX8, 30ns, CMOS, CPGA50
类别
Semiconductors Memory ICs SRAMs SRAM MODULE

ECCN
3A991.b.2.a
ECCN Governance
EAR
HTS Code
8542.32.00.41
SB Code
8542.32.00.40

Technology
CMOS
Width (mm)
13.716
Length (mm)
25.146
JESD-30 Code
R-CPGA-P50
Memory Width
8
Package Code
APGA
Output Enable
YES
Package Shape
RECTANGULAR
Package Style
GRID ARRAY, PIGGYBACK Meter
Surface Mount
NO
Terminal Form
PIN/PEG
Memory IC Type
SRAM MODULE
Operating Mode
ASYNCHRONOUS
Number of Ports
1
Parallel/Serial
PARALLEL
DLA Qualification
Not Qualified
Temperature Grade
MILITARY
Terminal Position
PERPENDICULAR
Additional Feature
USER CONFIGURABLE AS 512K X 16
Memory Organization
1MX8
Number of Functions
1
Number of Terminals
50
Terminal Pitch (mm)
2.54
Access Time-Max (ns)
30
Number of Words Code
1M
Memory Density (bits)
8388608
Package Body Material
CERAMIC, METAL-SEALED COFIRED
Output Characteristics
3-STATE
Seated Height-Max (mm)
21.0312
Supply Voltage-Max (V)
5.5
Supply Voltage-Min (V)
4.5
Supply Voltage-Nom (V)
5
Number of Words (words)
1048576
Standby Voltage-Min (V)
2
Operating Temperature-Max (Cel)
125
Operating Temperature-Min (Cel)
-55