DPAC TECHNOLOGIES CORP DPS256X32V3-35C | 搜芯易Sourcengine

DPAC TECHNOLOGIES CORP DPS256X32V3-35C

生命周期状态
Discontinued
说明
SRAM Module, 256KX32, 35ns, CMOS, CPGA66
类别
Semiconductors Memory ICs SRAMs SRAM MODULE

ECCN
3A991.b.2.a
ECCN Governance
EAR
HTS Code
8542.32.00.41
SB Code
8542.32.00.40

Technology
CMOS
JESD-30 Code
R-CPGA-P66
Memory Width
32
Package Code
APGA
Output Enable
YES
Package Shape
RECTANGULAR
Package Style
GRID ARRAY, PIGGYBACK Meter
Surface Mount
NO
Terminal Form
PIN/PEG
Memory IC Type
SRAM MODULE
Operating Mode
ASYNCHRONOUS
Number of Ports
1
Parallel/Serial
PARALLEL
DLA Qualification
Not Qualified
Temperature Grade
COMMERCIAL
Terminal Position
PERPENDICULAR
Memory Organization
256KX32
Number of Functions
1
Number of Terminals
66
Terminal Pitch (mm)
2.54
Access Time-Max (ns)
35
Number of Words Code
256K
Memory Density (bits)
8388608
Package Body Material
CERAMIC, METAL-SEALED COFIRED
Alternate Memory Width
16
Output Characteristics
3-STATE
Seated Height-Max (mm)
10.16
Supply Voltage-Max (V)
5.5
Supply Voltage-Min (V)
4.5
Supply Voltage-Nom (V)
5
Number of Words (words)
262144
Standby Voltage-Min (V)
2
Operating Temperature-Max (Cel)
70
Operating Temperature-Min (Cel)
0