DPAC TECHNOLOGIES CORP DPS256X32L-35C | 搜芯易Sourcengine

DPAC TECHNOLOGIES CORP DPS256X32L-35C

生命周期状态
Transferred
说明
SRAM Module, 256KX32, 35ns, CMOS
类别
Semiconductors Memory ICs SRAMs SRAM MODULE

ECCN
3A991.b.2.a
ECCN Governance
EAR
HTS Code
8542.32.00.41
SB Code
8542.32.00.40

I/O Type
COMMON
Technology
CMOS
JESD-30 Code
R-XZMA-T64
Memory Width
32
Package Code
ZIP
Output Enable
YES
Package Shape
RECTANGULAR
Package Style
MICROELECTRONIC ASSEMBLY Meter
Surface Mount
NO
Terminal Form
THROUGH-HOLE
J-STD-609 Code
e0
Memory IC Type
SRAM MODULE
Operating Mode
ASYNCHRONOUS
Number of Ports
1
Parallel/Serial
PARALLEL
Terminal Finish
Tin/Lead (Sn/Pb)
DLA Qualification
Not Qualified
Temperature Grade
COMMERCIAL
Terminal Position
ZIG-ZAG
Additional Feature
USER CONFIGURABLE AS 1M X 8
Memory Organization
256KX32
Number of Functions
1
Number of Terminals
64
Terminal Pitch (mm)
1.27
Access Time-Max (ns)
35
Number of Words Code
256K
Memory Density (bits)
8388608
Package Body Material
UNSPECIFIED
Alternate Memory Width
16
Output Characteristics
3-STATE
Seated Height-Max (mm)
14.478
Supply Voltage-Max (V)
5.5
Supply Voltage-Min (V)
4.5
Supply Voltage-Nom (V)
5
Number of Words (words)
262144
Standby Current-Max (A)
0.08
Standby Voltage-Min (V)
4.5
Supply Current-Max (mA)
1440
Package Equivalence Code
ZIP64/68,.1,.1
Operating Temperature-Max (Cel)
70
Operating Temperature-Min (Cel)
0