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DPS256X16AA3-70I

DPAC TECHNOLOGIES CORP

DPAC TECHNOLOGIES CORP DPS256X16AA3-70I
  • ECCN
    3A991.b.2.a
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.41
  • SB Code
    8542.32.00.40
  • Technology
    CMOS
  • JESD-30 Code
    R-CPGA-P50
  • Memory Width
    16
  • Package Code
    APGA
  • Output Enable
    YES
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY, PIGGYBACK Meter
  • Surface Mount
    NO
  • Terminal Form
    PIN/PEG
  • Memory IC Type
    SRAM MODULE
  • Operating Mode
    ASYNCHRONOUS
  • Number of Ports
    1
  • Parallel/Serial
    PARALLEL
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    PERPENDICULAR
  • Memory Organization
    256KX16
  • Number of Functions
    1
  • Number of Terminals
    50
  • Access Time-Max (ns)
    70
  • Number of Words Code
    256K
  • Memory Density (bits)
    4194304
  • Package Body Material
    CERAMIC, METAL-SEALED COFIRED
  • Alternate Memory Width
    8
  • Output Characteristics
    3-STATE
  • Supply Voltage-Max (V)
    5.5
  • Supply Voltage-Min (V)
    4.5
  • Supply Voltage-Nom (V)
    5
  • Number of Words (words)
    262144
  • Standby Voltage-Min (V)
    2
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40

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