DPAC TECHNOLOGIES CORP DPS1MX8MKN3-25M | 搜芯易Sourcengine

DPAC TECHNOLOGIES CORP DPS1MX8MKN3-25M

生命周期状态
Transferred
说明
SRAM Module, 1MX8, 25ns, CMOS, CDMA32
类别
Semiconductors Memory ICs SRAMs SRAM MODULE

ECCN
3A991.b.2.a
ECCN Governance
EAR
HTS Code
8542.32.00.41
SB Code
8542.32.00.40

I/O Type
COMMON
Technology
CMOS
JESD-30 Code
R-CDMA-T32
Memory Width
8
Package Code
DIP
Output Enable
NO
Package Shape
RECTANGULAR
Package Style
MICROELECTRONIC ASSEMBLY Meter
Surface Mount
NO
Terminal Form
THROUGH-HOLE
J-STD-609 Code
e0
Memory IC Type
SRAM MODULE
Operating Mode
ASYNCHRONOUS
Number of Ports
1
Parallel/Serial
PARALLEL
Terminal Finish
Tin/Lead (Sn/Pb)
DLA Qualification
Not Qualified
Temperature Grade
MILITARY
Terminal Position
DUAL
Memory Organization
1MX8
Number of Functions
1
Number of Terminals
32
Terminal Pitch (mm)
2.54
Access Time-Max (ns)
25
Number of Words Code
1M
Memory Density (bits)
8388608
Package Body Material
CERAMIC, METAL-SEALED COFIRED
Output Characteristics
3-STATE
Supply Voltage-Max (V)
5.5
Supply Voltage-Min (V)
4.5
Supply Voltage-Nom (V)
5
Number of Words (words)
1048576
Standby Current-Max (A)
0.0036
Standby Voltage-Min (V)
2
Supply Current-Max (mA)
240
Package Equivalence Code
DIP32,.6
Operating Temperature-Max (Cel)
125
Operating Temperature-Min (Cel)
-55
Screening Level / Reference Standard
MIL-STD-883 Class B (Modified)