DPAC TECHNOLOGIES CORP DPS1MX16MKJ3-25B | 搜芯易Sourcengine

DPAC TECHNOLOGIES CORP DPS1MX16MKJ3-25B

生命周期状态
Transferred
说明
SRAM Module, 1MX16, 25ns, CMOS
类别
Semiconductors Memory ICs SRAMs SRAM MODULE

ECCN
3A991.b.2.a
ECCN Governance
EAR
HTS Code
8542.32.00.41
SB Code
8542.32.00.40

I/O Type
COMMON
Technology
CMOS
JESD-30 Code
R-XQMA-J52
Memory Width
16
Package Code
QCCJ
Output Enable
YES
Package Shape
RECTANGULAR
Package Style
MICROELECTRONIC ASSEMBLY Meter
Surface Mount
YES
Terminal Form
J BEND
J-STD-609 Code
e0
Memory IC Type
SRAM MODULE
Operating Mode
ASYNCHRONOUS
Number of Ports
1
Parallel/Serial
PARALLEL
Terminal Finish
Tin/Lead (Sn/Pb)
DLA Qualification
Not Qualified
Temperature Grade
MILITARY
Terminal Position
QUAD
Memory Organization
1MX16
Number of Functions
1
Number of Terminals
52
Terminal Pitch (mm)
1.27
Access Time-Max (ns)
25
Number of Words Code
1M
Memory Density (bits)
16777216
Package Body Material
UNSPECIFIED
Alternate Memory Width
8
Output Characteristics
3-STATE
Supply Voltage-Max (V)
5.5
Supply Voltage-Min (V)
4.5
Supply Voltage-Nom (V)
5
Number of Words (words)
1048576
Standby Current-Max (A)
0.0072
Standby Voltage-Min (V)
2
Supply Current-Max (mA)
480
Package Equivalence Code
LDCC52,.56X.98
Operating Temperature-Max (Cel)
125
Operating Temperature-Min (Cel)
-55
Screening Level / Reference Standard
38535Q/M;38534H;883B