DPAC TECHNOLOGIES CORP DPS128X16BI3-35M | 搜芯易Sourcengine

DPAC TECHNOLOGIES CORP DPS128X16BI3-35M

生命周期状态
Transferred
说明
SRAM Module, 128KX16, 35ns, CMOS
类别
Semiconductors Memory ICs SRAMs SRAM MODULE

ECCN
3A991.b.2.a
ECCN Governance
EAR
HTS Code
8542.32.00.41
SB Code
8542.32.00.40

I/O Type
COMMON
Technology
CMOS
Width (mm)
12.7
JESD-30 Code
R-XQIP-T48
Memory Width
16
Package Code
AQIP
Output Enable
YES
Package Shape
RECTANGULAR
Package Style
IN-LINE, PIGGYBACK Meter
Surface Mount
NO
Terminal Form
THROUGH-HOLE
J-STD-609 Code
e0
Memory IC Type
SRAM MODULE
Operating Mode
ASYNCHRONOUS
Number of Ports
1
Parallel/Serial
PARALLEL
Terminal Finish
Tin/Lead (Sn/Pb)
DLA Qualification
Not Qualified
Temperature Grade
MILITARY
Terminal Position
QUAD
Additional Feature
CONFIGURABLE AS 128K X 16
Memory Organization
128KX16
Number of Functions
1
Number of Terminals
48
Terminal Pitch (mm)
1.27
Access Time-Max (ns)
35
Number of Words Code
128K
Memory Density (bits)
2097152
Package Body Material
UNSPECIFIED
Alternate Memory Width
8
Output Characteristics
3-STATE
Seated Height-Max (mm)
4.3434
Supply Voltage-Max (V)
5.5
Supply Voltage-Min (V)
4.5
Supply Voltage-Nom (V)
5
Number of Words (words)
131072
Standby Current-Max (A)
0.0036
Standby Voltage-Min (V)
2
Supply Current-Max (mA)
320
Package Equivalence Code
QUAD48,.9X.5,50
Operating Temperature-Max (Cel)
125
Operating Temperature-Min (Cel)
-55
Screening Level / Reference Standard
MIL-STD-883 Class B (Modified)